2015 Workshop Exhibitors
Synopsys, Inc.
contact: Celia Suez
phone: 650-584-4263
email: celias@synopsys.com
web: www.synopsys.com
Robust Chip Inc.
contact: Klas Lilja
phone: 925-425-0820
email: klas.lilja@robustchip.com
web: www.robustchip.com
Space Micro, Inc.
Contact: Dave Strobel
phone: 858-332-0700
email: dstrobel@spacemicro.com
web: www.spacemicro.com
Cobham Semiconducor Solutions
(formerly Aeroflex)
contact: Teresa Farris
phone: 719-594-8035
email: teresa.farris@aeroflex.com
web: www.aeroflex.com/HiRel
ULTRA TEC
contact: Tim Hazeldine
phone: 714-542-0608
email: tim@ultratecusa.com
web: www.ultratecusa.com
3D Plus
contact: John Quinn
phone: 214-733-8505
email: jquinn@3d-plususa.com
web: www.3dplus.com
Microsemi
contact: Sylvia Keane
phone: 949-380-6159
email: sylvia.keane@microsemi.com
web: www.microsemi.com
National Reconnaissance Office (NRO)
contact: Kevin Donaleski
phone: 703-808-3412
email: DII@nro.mil
web: DII.westfields.net
BAE Systems
contact: Ram Ramaswamy
phone: 571-364-7810
email: ram.ramaswamy@baesystems.com
web: www.rad750.com
EMPC
contact: Thomas M. Jordan
email: tj@empc.com
phone: 301-869-2317
web: www.empc.com
Dini Group
contact: Marcellino Greggio
email: marcellinog@dinigroup.com
phone: 858-454-3419
web: www.dinigroup.com
Mentor Graphics
Contact: Shashi Bhutada
Phone: 310-563-5906
email: shashi_bhutada@mentor.com
web: www.mentor.com
Riscure
Contact: Mats Nahlinder
Phone: 650-646-9979
email: nahlinder@na.riscure.com
web: www.riscure.com
General Chair(s): Dale McMorrow, NRL (SEE) / Brett Attaway, Synopsys (MAPLD)
Technical Program Chair(s): Klas Lilja, Robust Chip, Inc. (SEE) / Fernanda Lima Kastensmidt, UFRGS (MAPLD)
Poster Session Chair: Martha O'Bryan, AS and D, Inc. / GSFC
Industrial Exhibit Chairwoman: Teresa Farris, Aeroflex Corp.
Local Arrangements & Registration Services: Susan Hunt, STAMP Services
Website Curator: Carl Szabo, AS and D, Inc. / GSFC
SEE Symposium and MAPLD are supported by the Aeroflex Corporation, the Aerospace Corporation, Brigham Young University, Lockheed Martin, the NASA Electronic Parts and Packaging Program, the Naval Research Laboratory, Sandia National Laboratories, and Vanderbilt University.
SEE Symposium and MAPLD are sponsored by SEE Symposium, California